________________________________________________________________________ http://www.union - ic.com rev .0 3 m a y .201 6 1 /5 sm12/sm15 low capacitance dual line esd protection diode arr a y sm12/sm15 sot23 - 3 general description the sm12/sm15 of transient voltage suppressors (tvs) are designed to protect components which are connected to data and transmission lines from voltage surges caus ed by electrostatic discharge (esd). tvs diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. this makes them ideal for use as board level protection of sensitive semiconductor components. th e dual - junction common - anode design allows the user to protect one bidirectional data line or two unidirectional lines. the low profile sot23 - 3 package allows flexibility in the design of crowded circuit boards. the sm12/sm15 will meet the surge requirem ents of iec 61000 - 4 - 2 (formerly iec801 - 2), level 4, human body model for air and contact discharge. applications features ? cellular handsets and accessories ? portable electronics ? industrial controls ? set - top box ? servers, notebook and desktop pc ? t ransient p rotection for d ata & p ower l ines to i ec 61000 - 4 - 2 (esd) 15kv ( a ir), 8kv ( c ontact) ? protects o ne b idirectional l ine or t wo u nidirectional l ines ? w o rking voltages: 12v (sm12) 15v (sm15) ? low c lamping v oltage ? solid - s tate s ilicon a valanche t echnol ogy pin configurations top view m: month code sm12 sot23 - 3 m: month code sm15 sot23 - 3 1 2 3
________________________________________________________________________ http://www.union - ic.com rev .0 3 m a y .201 6 2 /5 sm12/sm15 o rdering information part number working v oltage packaging type channel marking code s hipping qty sm12 12.0v sot23 - 3 2 s12 3000 pcs /7 inch t ape & reel sm15 15.0v s15 absolute maximum ratings r a t i n g s y m b o l v a l u e u n i t peak pulse power (t p = 8/20s) p pk 140 watts thermal resistance, junction to ambient ja 325 c/w lead soldering temperature t l 260 (10 sec.) c operating temperatur e t j - 55 to +125 c storage temperature t stg - 55 to +125 c - electrical characteristics (sm12) p a r a m e t e r s y m b o l c o n d i t i o n s m i n t y p m a x u n i t reverse stand - off voltage v rwm 12 v reverse breakdown voltage v br i t = 1ma 16 18 v reverse leakage c urrent i r v rwm = 12 v, t=25c 1 a clamping voltage v c i pp = 5.9a, t p = 8/20 s 23 v peak pulse current i pp t p = 8/20 s 5.9 a junction capacitance c j pin 1 to 3 and pin 2 to 3, v r = 0v, f = 1mhz 20 30 pf reverse d ynamic r esistance r dyn,rev i pp < 2a 1.12 forward d ynamic r esista nce r dyn,fwd 0.81 reverse d ynamic r esistance r dyn,rev i pp >2a 0.92 forward d ynamic r esistance r dyn,fwd 0.42
________________________________________________________________________ http://www.union - ic.com rev .0 3 m a y .201 6 3 /5 sm12/sm15 electrical characteristics (sm15) p a r a m e t e r s y m b o l c o n d i t i o n s m i n t y p m a x u n i t reverse stand - off voltage v rwm 1 5 v reverse breakdown voltage v br i t = 1ma 16.7 18.7 v reverse leakage current i r v rwm = 1 5v, t=25c 1 a clamping voltage v c i pp = 5 .9 a, t p = 8/20 s 23 v peak pulse current i pp t p = 8/20 s 5.9 a junction capacitance c j pin 1 to 3 and pin 2 to 3 , v r = 0v, f = 1mhz 20 30 pf reverse d ynamic r esistance r dyn,rev i pp < 2a 1.12 forward d ynamic r esistance r dyn,fwd 0.81 reverse d ynamic r esistance r dyn,rev i pp >2a 0.92 forward d ynamic r esistance r dyn,fwd 0.42 detailed description device connect ion options sm12/sm15 is designed to protect one bidirectional or two unidirectional data or i/o lines operating at 12v/ 15v . connection options are as follows: bidirectional: pin 1 is connected to the data line and pin 2 is connected to ground (since the device is symmetrical, these connections may be reversed). the ground connection should be made directly to a ground plane. the path length should be kept as short as possible to minimize parasitic induc tance. pin 3 is not connected. unidirectional: data l ines are connected to pin 1 and pin 2. pin 3 is connected to ground. for best results, this pin should be connected directly to a ground plane on the board. the path length should be kept as short as possible to minimize parasitic inductance. circuit boar d layout recommendations for suppression of esd good circuit board layout is critical for the suppression of fast rise - time transients such as esd. the following guidelines are recommended (refer to application note si99 - 01 for more detailed information): place the tvs near the input terminals or connectors to restrict transient coupling. minimize the path length between the tvs and the protected line. minimize all conductive loops including power and ground loops. the esd transient return path to ground sh ould be kept as short as possible. never run critical signals near board edges. use ground planes whenever possible. matte tin lead finish matte tin has become the industry standard lead - free replacement for snpb lead finishes. a matte tin finish is compo sed of 100% tin solder with large grains. since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the pcb, the reflow profile will be determined by the requirements of the solder paste. theref ore, these devices are compatible with both lead - free and snpb assembly techniques. in addition, unlike other lead - free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
________________________________________________________________________ http://www.union - ic.com rev .0 3 m a y .201 6 4 /5 sm12/sm15 package information sm12/sm15 : s ot23 - 3 outline drawing dimensions symbol millimeters in ches min typ max min typ max a 1.0 13 1.15 1. 40 0.04 0 0.045 0.0 55 a1 0.0 0 0.05 0.1 0 0.000 0.002 0.004 a2 1.0 0 1.10 1. 30 0.0 39 0.043 0.0 51 b 0. 30 - 0.50 0.01 2 - 0.020 c 0.10 0.15 0.20 0.004 0.006 0.008 d 2. 82 - 3. 10 0.11 1 - 0.1 22 e 1.50 1.60 1.70 0. 059 0.063 0.067 e 1 2.60 2.80 3.00 0.10 2 0.110 0.11 8 e 0.95ref 0.037ref e1 1.90ref 0.075ref l 0. 30 - 0. 60 0.01 2 - 0.02 4 0 - 8 0 - 8 land pattern notes: 1. compound dimension: 2.92 1 .60 2. unit: mm; 3. general tolerance 0.0 5 mm unless otherwise specified; 4. the layout is just for reference. tape and reel orientation e 1 e 1 b d e e a 2 a 1 a t o p v i e w s i d e v i e w 3 1 2 c l e n d v i e w 1 . 9 0 2 . 3 5 1 . 2 0 0 . 5 6 x x x m
________________________________________________________________________ http://www.union - ic.com rev .0 3 m a y .201 6 5 /5 sm12/sm15 green compliance union semiconductor is committed to environmental excellence in all aspects of its operations including meeting or exceeding regulatory requirements with respect to the use of hazardous substances. numerous successful programs have been implemented to reduce the use of hazardous substance s and/or emissions. all union components are compliant with the rohs directive, which helps to support customers in their compliance with environmental directives. for more green compliance information, please visit: http://www.union - ic.com/index.aspx?cat_code=rohsdeclaration important notice the information in this document has been carefully reviewed and is believed to be accurate. nonetheless, this document is subject to change without notice. union assumes no responsibility for any inaccuracies tha t may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. union reserves the right to make changes, at any time, in order to improve reliability , function or design and to attempt to supply the best product possible. union semiconductor, inc add: unit 606, no.570 shengxia road, shanghai 2012 10 tel: 021 - 5109 3966 fax: 021 - 51026018 website: www.union - ic.com
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